The 2014 Hilti IT Innovation Competition

TYPE OF CONTEST: ICT Contest

BRIEF DESCRIPTION: Methods of communication and collaboration are constantly evolving. Ten years ago, team members would share documents via e-mail or internal mail. Now, team members easily work with shared documents in online collaboration rooms and virtual workplaces – collaboration can take place anytime, anywhere.

Who could have guessed in 2003 that 2013 would look so different? Maybe you, if someone had bothered to ask. Students are often the first movers in adopting new technologies to increase their productivity. The ubiquity of applications like Dropbox, Google Docs and Facebook are perfect illustrations.

That is why we want your thoughts on how you envision the future communication and collaboration between Hilti and our customers as well as within Hilti. Think about historical trends and recent market developments in order to imagine future communication and collaboration processes, software or hardware that will enable us to create more outstanding added value.

ELIGIBILITY: The Competition is open to young professionals and students from universities or universities of applied science from all disciplines around the world

RULES AND REGULATIONS: Please see here

PRIZE: The top 10 teams, designated as finalists, will be invited to a 2½-day workshop at Hilti headquarters in Liechtenstein (January 9-11, 2014). Here, teams can further develop their ideas and learn more about the Hilti business while networking with a group of highly creative individuals. All finalists are also invited to an awards ceremony where they will be recognized for their accomplishments by Hilti’s CIO and the competition’s international jury.

The prizes are:
1st place: Once-in-a-lifetime trip to one of our overseas locations (Kuala Lumpur (Malaysia), Tulsa, Okla. (USA) or Schaan (Liechtenstein))

2nd and 3rd place: Hilti power tool

All finalists: Easier access to internships and the opportunity to launch your collaboration idea.

HOW TO APPLY: Please see here

DEADLINE: November 18, 2013